INTEGRATED
INTEGRATED
1 thick film integrated circuits
Thick film hybrid integrated circuit is a kind of micro electronic components refers to the resistance, inductance and capacitance, semiconductor devices and interconnect wires by printing, sintering and welding processes, the circuit unit has a function of ceramic / aluminum nitride / metal substrate. Thick film circuit has the advantages of reliable performance, high precision, flexible design, high density, small size, impact resistance, vibration, should be used for high voltage, high current, high power occasions. Customizable development.
2 process flow chart
The conductor - drying - - resistance printing - drying, sintering, laser trimming around the junction - protective paint printing - curing - visual inspection - - - solder paste printing component mounting reflow soldering pin - Installation - pin - dip - shear pin - cleaning inspection - parameter test - package / coating - Test - Packaging - Test - storage
3 process parameters
Substrate material | Alumina ceramics, aluminum nitride, stainless steel |
Conductor type | Palladium silver series, platinum silver series, gold paste |
Resistance material | Ruthenium oxide series |
line width | Minimum 0.15mm |
thickness | 5~20um |
Substrate size | 3mm*3mm~100mm*100mm(300mm*80mm) |
Resistance range | 10 mΩ---10 GΩ |
Absolute accuracy of resistance | +/-0.5% |
Resistance matching precision | +/-0.1% |
Pin mode | Patch 2.54mm or in-line 2.16mm |
Encapsulation mode | Phenolic resin encapsulation, ceramic / metal / plastic shell potting |
Component installation | SMT mount, MCM process |
Functional modification | Functional dynamic correction |
4 processing capacity
Can realize the thick film process and MCM process on various substrates, has 31 years of production experience, to become the largest supplier in the field of communications, with DuPont, Heraeus is committed to long-term cooperation and development relations, products are widely used in communications, military, automotive, industrial control and other industries, to provide customized design, test scheme, solution special requirements for products of high precision, miniaturization, heat dissipation, high stability.
5 equipment capacity
Screen printing machine 10, drying furnace 4 units, BTU and SERISM 4 laser sintering furnace, resistance repair machine 4 sets, several sets of test system, environmental protection cleaning machine 1, semi automatic wire welding machine 4 sets, 3 sets of laser thickness gauge, automatic dispensing machine 1 sets, 1 sets of automatic pressure welder.