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EMSTECHNOLOGY

1 process flow chart

PCB plate element baking - / solder paste printing solder paste inspection - mount components - - ---AOI - reflow soldering cartridge plastic welding - Welding / pre - Cleaning - label - board ---ICT--- visual inspection - burning process ---FCT--- paint curing - shell assembly ---FCT--- - package - aging test --- --- --- plug-in storage assembly wave

2 工艺参数       

PCB size

50mm*50mm-510mm*460mm

PCB Plate type

Epoxy glass fiber board, aluminum substrate, FPC, etc.

Component type

A variety of SMD components, plug-in components

Element size

Inch 0201、QFP/BGA:50mm*50mm

Minimum component pin spacing

QFP0.3mm、BGA:0.4mm

Mounting precision

0.05mm(CHIP),0.03mm(QFP)

Environmental attributes

ROHS6、ROHS5、No halogen

Current carrying welding atmosphere

N Gas protection

nspection method

ICT/FCT/X-ray/AOI/SPI

Coating method

Automatic selective coating

Throughput

900KCPH

3 processing capacity

As the first PCBA factory in Chongqing, can undertake OEM or ODM processing module, providing board level and product level processing, with electronic product hardware and software development capabilities, can help customers to optimize design and reduce the cost, meet a variety of flexible production. Other auxiliary selection method, solder love 1000 live, BECK and other world-renowned company materials, in cooperation with Emerson, ASUS, Ford, Zounds, and other long-term supporting TERUIDE four.

4 equipment capacity

With 10 SMT lines and 6 PA lines, Matsushita, YAMAHA and other major equipment placement machine 19 units, Heller and REHM reflow furnace 10, GKG and DEK 10 sets of printing machines, wave soldering furnace 5, AOI 6, SPI 1, X ray 1, 4 sub machine cutter Taiwan, take knife machines 6 sets, automatic coating machine 1 sets, 1 sets of automatic labeling machine, automatic marking machine 1.


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